[ Application & Application form ]
(pic : Free-Photos / 9129, pixabay.com)
○ Initial Team Build-up : No more than 4 people
max 4 persons comprise of 1 H/W developer or more, 1 S/W developer or more
※ Please note that 3D modeling, 3D printing, laser cutting, CNC engraving, PCB, SMT will be serviceable at Makerspace G·Camp
○ Development. Condition : Dev. Condition : STM32CubeMX(Mandatory) + STM32Cube.AI (Optional but if you succeed to build, you will get additional 5 points)
Dev. Support : AWS IoT, Thingspark
Dev. Board : B-L4S5I-IOT01A (Mandatory) ※ A Dev. Board per team will be issued with a starter kit.
○ Application Form [Download application form below]
application_form_seoul_Hardware_hackathon_English.docx - Please fill it out the application and send it to us at Mr. Kitae Park, at Makerspace G·Camp, gitaepak@sba.kr / 02-2135-5280, 010-6785-3678
and fill out Google form at https://forms.gle/wgoxq447j5aqh4zJ7
- Deadline: 8.Dec. 2020
