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01_Overview/Participation_Condition

(2018) Application & Application form

[ Application & Application form ]

(pic : Free-Photos / 9129, pixabay.com)


○ Initial Team Build-up : No more than 3 people

  max 3 persons comprise of 1 H/W developer or more, 1 S/W developer or more 

  ※ Please note that 3D modeling, 3D printing, laser cutting, CNC engraving will be serviceable at Seoul IoT Center. 

   → After team build-up process, we will build 15 teams (SME Team + Student Engineer Team, SME Team + Foreigners Team, or Student Engineer Team +Foreigners Team). 

 * Student Engineer means one who have engineering background or have equivalent skills. 


○ Development. Condition

   - All united teams shall use and develop arm MBED(www.mbed.org) and Daliworks Thing +(www.thingplus.net※ a starter kit and video tutorial will be provided for each team selected. 



○ Application Form  [Download application form below]


application_form_seoul_iot_hackathon.docx




○ Submission and its Deadline

  - Please fill it out the 3 pages of the application and send it to us at Mr. Kitae Park, at Seoul IoT Center, gitaepak@sba.kr / 02-6283-1004, 010-6785-3678   

   - Deadline:  19 Aug. 2018



 
90, Digital-ro 9-gil, Geumcheon-gu, Seoul, Republic of Korea
https://seoulhackathoneng.tistory.com/   
mail: 12000@12000.co Tel : +82-2-2135-5280
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90, Digital-ro 9-gil, Geumcheon-gu, Seoul, Republic of Korea https://seoulhackathon.tistory.com
mail: 12000@12000.co Tel : +82-2-2135-5280